ASML will roll out its 300mm lithography suite at Tata Electronics’ Dholera plant, targeting a monthly output of 50,000 wafers for automotive chips.
The Dholera fab, backed by an $11 billion investment, will harness process nodes ranging from 28 nm to 110 nm courtesy of Powerchip’s tech stack. Those nodes are perfect for the range of power‑management ICs, display drivers and microcontrollers that modern EVs and autonomous systems depend on. With this, Indian automakers could finally cut the lag in sourcing high‑performance silicon from overseas.
India’s government has earmarked duty exemptions for semiconductor fabs and is tightening the EV mandate to boost domestic component manufacturing. By aligning with ASML’s cutting‑edge lithography, the Dholera project positions itself at the intersection of policy and technology, aiming to meet the country’s goal of 10% local chip production by 2030.
ASML’s role goes beyond hardware; the company will also roll out computational lithography software and metrology tools to squeeze yield and performance out of each wafer. This holistic approach is expected to keep the fab’s throughput high while keeping defect rates low—critical for the reliability required in safety‑critical automotive modules.
The first chips are slated for rollout in late 2027, with full capacity expected by 2029. Automakers such as Tata Motors, Mahindra, and new EV entrants will likely source power‑management and MCU silicon from Dholera, and analysts will watch how quickly the supply chain adapts.